Our manufacturing department provides many solutions for the production of electronic products.
At the request of our clients we undertake the production of printed circuit boards. The required parts are obtained from our qualified suppliers and we prepare the process by creating the stencil and framing it based on preliminary production documentation. We can handle both manual and conventional flat panel (THD) and surface mount (SMD) parts and in the latter case we have a placement machine. We also undertake complete projects from financial planning to shelf-readiness.

Based on mechanical designs, we can produce prototypes and small parts of protective sheet and other features with our milling machines located at our site. In the case of larger series, our extensive network of partners can organize complete mechanical production after the design and approval of the project plan required for this purpose.
Assembly process

Our team performs the protocols and assembly of large series with outstanding expertise. We pay particular attention to optimizing assembly lines, especially in terms of flexibility, so that work can be done smoothly even after possible reorganization. We also prepare a complete manual for all parts and assembling instructions for the prototype, and we offer a wide range of test procedures for both simple and complex designs.


SMD and conventional part implantation technologies

SMD part implantation:

  • leady or lead free printing using AUTOTRONIK SP600 semi-automatic stencil printer:
    • printing area: 600*400mm
    • maximum PCB size: 650*410mm
    • Dual camera system for fast and accurate PCB positioning
  • component implantation using SAMSUNG SM482 6-spindle pick and place machine:
    • from 0201 to 55 * 55mm components, up to 15mm height
    • measuring of small parts on the go, Flying Vision technology
    • fixed-camera monitoring of large parts, Stage Vision technology
    • implantation accuracy: ±50μm@μ+3σ/Chip, ±30μm@μ+3σ/QFP
    • handling a maximum of 120 docking carts
    • handling tray components
    • maximum 28 000 chips/hour implant performance
    • minimum PCB size: 50*40mm, maximum: 601*480mm
    • PCB thickness: 0,38-4,2mm
  • manual component implantation:
    • specially shaped or sized components are implanted manually in an antistatic environment
  • Soldering of SMD components:
    • using ASSCON VP800 vapor-phase reflow soldering system, whose advantages include:
      • lower solder temperature
      • oxygen-free preheating and soldering process, which results in better quality soldering
      • less VOID is generated than when soldering with conventional reflow furnaces
      • maximum PCB size: 610*460mm
  • implanted panels always undergo visual inspection, if necessary with a microscope

Conventional component implantation:

  • preparation of parts with bending and cutting machines
  • soldering can be done with lead and lead free wire
  • soldering is done with high-performance JBC pails that are excellent for performing large-area lead-free soldering
  • implanted panels always undergo visual inspection, if necessary with a microscope

Programming of panels:

  • it is also possible to program the manufactured panels according to the order of the customer

Panel resuscitation and testing:

  • depending on the customer’s request, it is possible to resuscitate, calibrate and test the panels manufactured according to the customer’s instructions.

Our company undertakes the development of programming-, calibration-, resuscitation and test procedures.

Prefabricated cables:

  • machine-assisted cutting and disassembling of cables
  • crimping wound ends and slots
  • making cable harnesses
  • testing cables on demand

Manufacturing finished products:

  • mechanical design
  • machining aluminum sheets with CNC milling machine
  • installation and wiring of panels
  • assembly inspection
  • painting of fronts and backs, preparation and implementation of a stain plan
  • testing
  • packaging